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  1. SUSS ProbeShield® Technology - Home

    ProbeShield Technology from SUSS MicroTec is the solution for highly accurate device characterization and reliability test of semiconductor devices.
    modeling3
    test system1
    WLR1
    semiconductor test1
    probe station1
    Wafer level1
    wafer probing1
    wafer test1
    device characterization1
    parametric test1
    on wafer0
    probe system0
    wafer level reliability0

    www.probeshield.com - 2009-02-09

  2. MCSP -- Micro Chip-Scale Packages

    Micro-Chip Scale Packaging (MCSP) competes in the rapidly expanding global electronic marketplace where its leading-edge technologies continue to increase ...
    Bluetooth2
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    semiconductor2
    CSP1
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    RF network1
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    microcsp1
    glass substrate1
    wafer stacking1
    dielectric layer1
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    intergrated circuit1
    stacked CSP1
    die level package0
    glass cavity0
    resistor capacitor on die0
    stacked IC0
    via in glass0
    wafer level chip scale package0

    www.microcsp.com - 2009-02-12

  3. IMAPS - International Microelectronics And Packaging Society - Bringing Together The Entire Microelectronics Supply Chain

    IMAPS is bringing together the entire microelectronics supply chain. The largest society dedicated to the advancement and growth of microelectronics and ...
    packaging3
    nanotechnology2
    circuits2
    semiconductors2
    LEDs2
    microchip1
    mems1
    BGA1
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    fuel cells1
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    multichip1
    PWBs1
    wafer level1
    ball grid1
    device packaging1
    technical workshops1
    homeland electronics1
    microelectronics supply chain1
    system level packaging1

    imaps.org - 2009-04-10

  4. IMAPS 2009, San Jose - Call For Papers - 42nd International Symposium on Microelectronics

    IMAPS is bringing together the entire microelectronics supply chain. The largest society dedicated to the advancement and growth of microelectronics and ...
    packaging3
    nanotechnology2
    circuits2
    semiconductors2
    LEDs2
    microchip1
    mems1
    BGA1
    solder1
    fuel cells1
    interconnect1
    microelectronics1
    lead free1
    PCBs1
    thermal management1
    emerging technology1
    lead-free1
    automotive electronics1
    electronic packaging1
    flip chip1
    military electronics1
    biomedical electronics1
    multichip1
    PWBs1
    wafer level1
    ball grid1
    device packaging1
    technical workshops1
    homeland electronics1
    microelectronics supply chain1
    system level packaging1

    www.imaps2009.org - 2009-03-09

  5. Pac Tech - Pac Tech - Home

    Joomla! - dynamische Portal-Engine und Content-Management-System
    Equipment4
    Packaging3
    Semiconductor2
    Solder1
    Backend1
    Flip Chip1
    Wafer Bumping1
    Wafer Level1
    Pac Tech1
    WLCSP1

    pactech.com - 2009-04-11

  6. XLoom Communications, Chip Scale High Density Optics

    Infiniband,optics,chip scale,wafer level,pluggable,multi port,QSFP,XFP,packaging,InfiniFlame's front-panel pluggability enables populate-as-you-grow of optical ...
    applications6
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    Quad2
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    XFP1
    chip scale1
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    wafer level1
    multi port1
    QSFP1
    GigaFlame0

    www.xloomcom.com - 2009-02-12

packaging3 wafer bumping1 wlcsp1 flip chip1 semiconductor2 pcb2 csp1 bga1 solder1

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